Epoxy turns rubbery with heat. You can probably use a hot air station to soften the epoxy and remove it. Yes the pcb is also made of epoxy but probably higher temp and the copper should wick away the heat enough that the added epoxy should soften first. Worth a try if you have already written it off.
The z-mote guy talked about having potentiometer issues with his prototypes and ended up using one that was rated for like a million cycles. You could check the part number of the Hoyt one and see what it is rated for and try to find a similar one with a longer estimated life
Throttle gave me a bit of a trouble as well. I didn’t want to use hall sensor because they are hard to get it just right and the output values are sometimes jumpy which is not ideal. I turned my attention to potentiometers but again most of the products are rated for 10-20K turn lifecycles. I found 2-3 products which are just right and rated for 1KK(1million) turn lifecycle and they are incredibly steady.
FWIW the hall sensor throttle on vesc wand is terrible and imo unusable.
Not sure which JB Weld you used, but seems like max temp is 150C so it probably hits the glass transition temperature just above that. Still colder than solder so I think it has a chance of working. I mean what will realistically get damaged? The pot? It’s already coming off…
But I think the issue is that Hoyt would have to be willing to adapt the firmware to the output curve of the HALL. I’m not sure they’d be willing to do that.
haha I’ll give it a shot when I have this puck in hand again. I’m a few hundred miles away from it right now. I seriously doubt it will be repairable when I get through my dremeling action on it
Not sure why y’all are assuming that the puck would need a new firmware for a drop-in hall sensor to work. The VX4 doesn’t need new firmware for the 3DS hall sensor to work, does it?
But also, I dont see us developing another new firmware specifically for someone’s 3rd party hall sensor install. We have a very small staff, and we’re extremely busy building boards and doing R&D on our own new products. We are not going to take time away from that to do R&D for someone else’s product.
are new Pucks being sold with the Battle hardened or is that still up to an end user?
Aside from mentioning that this shit is dangerous, there is no mention of the issue or the fix on the website, I was curious as the last one I got new most recently hadn’t despite me knowing it was new stock… was it just new old stock or new new stock?
AFAIK, they don’t “harden” it with epoxy but they lay a better bead of solder than early batches. As well as the shells have been modified from the originals to have better support for the pot.
Not perfect, never will be with the current design, but better than when first released.