The only thing I know about thermal dynamics is > surface area
I’m not exposing to air for her. I am at the point where I’m riding hard enough that I’m overheating with internal heatsinks. Going external on 12s build and then likely 4wd HV on bigger board.
I ordered the pads. then realized you said you prefer a thermal tape. I think it’ll be good though afaict my focboxes are bolted to the aluminum plate.
my reading tonight has led me to think that too. I think I may try that route instead.
OTOH the thermal pad that connects the FETS to the case has a much smaller area and is already limited by being a thermal pad. so I’m guessing the case to plate interface can keep up even with a much lower thermal conduction rate. hmm.
It’s hard to say, while they are is smaller, the FETs are hotter than the case, so the rate of thermal transfer between it and the case, even through a thermal pad can be higher resistance, can be higher, and also the cooler you can keep the case, the more heat goes from the FETs to it
So, Let me do these tests with proto#1 (10s5p 20700b 20T/62T 155mm tire diameter )
this is my thermal test run ESCs temps shows 77 and 88. 84m climb over about 2km distance. a bit steeper at the end.
it’s interesting the two temps were that different. perhaps I should replace the internal thermal pad before doing the ESC -> aluminum plate experiment.