Hey, Thank you for your suggestions.
for 1, Don’t worry for this point. Three layers of 5-ounce copper foil are used under this pad to conduct the positive current, and our new batch of MOS boards has further optimized and adjusted the layout of the mosfet bridge, changing from the original parallel layout to "7"shape layout. The current path is further optimized, so the copper busbar of the positive electrode of the new batch is omitted; the negative electrode is still reserved to maximize the heat capacity
for 2, I well noticed and in shipping assembly ,we don’t use too much screw force on it.
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