For thermal conductivity, more is better. It’s watts/ (meter * deg-K). For insulation, lower is better.
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No, higher is better.
The machine pin headers are OK. That wasn’t the problem.
Did you find out the problem?
I gave up. I don’t have the info I need to make the design. If someone wants to provide that, I’d be happy to do it.
You said you needed pictures with measurements right?
Which measurements are missing that you cannot get from den ECAD?
I’m happy to measure it if I can. I cannot provide good pics (my prototype is not how it should be assembled). I can print the model and provide feedback.
I’m starting to get a little annoyed by these machine pin headers that I introduced myself. The fact that a connector isn’t locked in position (like the jst) is a real world problem.
Anyone has knowledge of some kind of machine headers that can be locked in position? (where you are still able to detach the mcu board (pill))
Maybe I should just make a complete new pill design where all external connectors are on the pill and of type JST, with the exception of those going to the power board, which can stay as machine headers. - and then move CAN to the pill.
Maybe the IMU shouldn’t even be part of the board, but something that can be attached with an I2C or SPI connector. It’s just causing so much trouble with regards to the price of PCBs.
Going to make a pinout for Vbat, to allow the ability to store vital parameters between boot cycles. It’s very important in robotics - incremental encoders is a good example.
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Hmm, Machine headers for the power board has caused me issues.
- The pins interfer with the body of the MosFet lying flat.
- It’s so easy to bump the board, nocking it off and bending the pins. I now have done it onve to often, and pins are broken completely, so going to have to remove them …
I’ll tell you what… if you take some pics of your unit from several angles, I’ll mark them up with the dimensions I need, and ask a few questions. From that we can come up with a design that works for you.